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Heat dissipation board×モリマーエスエスピー - List of Manufacturers, Suppliers, Companies and Products

Heat dissipation board Product List

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Heat-dissipating substrate "Thick Copper Special Substrate"

Heat-dissipating substrate "Thick Copper Special Substrate"

A thick copper three-layer substrate with a total thickness of 0.35mm! Suitable for applications such as mobile phone camera flash substrates.

We handle "heat dissipation structure substrates" with built-in copper. We use a thick copper three-layer substrate (inner layer copper thickness 0.2mm, total board thickness 0.35mm) and ultra-thin PP (0.03mm). These are used for applications such as mobile phone camera flash substrates. 【Required Performance】 ■ Circuit and SR alignment tolerance of 0.04mm ■ Surface treatment for gold wire bonding (electroless NiPdAu plating) ■ Deviation tolerance between the outer shape centerline and the component pad centerline of ±0.075mm *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Other electronic parts

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Heat dissipation substrate "Heat dissipation Via"

Heat dissipation substrate "Heat dissipation Via"

Multilayering of thick copper substrates is also possible! We can handle filling of blind vias and vacuum filling in-house.

Our company handles the heat dissipation substrate "Heat Dissipation Via." With the increasing heat generation due to the high performance and miniaturization of electronic components, there is a growing need for heat dissipation pathways that allow the heat generated by components to escape from the space to the pattern, in order to maintain the performance of electronic devices and extend their lifespan. We propose solutions to these issues as heat dissipation measures. It is also possible to create multilayer thick copper substrates, allowing for the development of new applications that have not been seen before. 【Features】 ■ Thick copper substrate with copper foil thickness of 210μm ■ Copper paste VIA hole filling (thermal conductivity 0.58–7.8W/mk) - Small diameter VIA φ 0.15 is supported, - Bottom-filled VIA hole filling can also be handled in-house with vacuum filling. *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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